Special Features:

Silicone based thermal grease that conducts heat between hot coponent and a heat sink or enclosure; fills interface variable tolerances in electronics assemblies and heat sink applications; non curing, dispensable, highly conformable materials require no cure cycle, mixing or refrigeration; thermally stable and require virtually no compressive force to deform under assembly pressure; meet the need for high power applications requiring material with bond line thickness and high conductivity; ideal for rework and field repair situations; operating temp range-minus 55c to 200c

Properties:

Chemical composition which is specifically compounded to provide thermal insulating characteristics.