Special Features:

Items are being coded as critical to insure source inspection will be performed at the point of manufacture, prior to material receipt by the us navy or other dod components. These items are piece parts or end items in support of vital military hardware necessary to sustain the successful mission of the ships, submarines, and shore stations of the us navy. Critical features including, but not limited to, dimensions, tolerances/clearances, electronic characteristics, and metallurgical properties will bespecified for government q ar (quality assurance representatives) to insure the highest possible degree of quality and reliability of these parts being delivered under navicp contracts; explosive ordnance disposal tools/equipment

Properties:

A grouping of two or more semiconducting devices such as light emitting diode; semiconductor device, diode; semiconductor device, photo; semiconductor device, thyristor; and/or transistor mounted on a common mounting or mounted on each other. The devices must be separable and each item must be capable of functioning in accordance with its given name. For assemblies consisting of semiconducting devices permanently cased, encapsulated, or potted together to form a single unit, see rectifier, semiconductor device, unitized and semiconductor devices, unitized. Excludes semiconductor device set; microcircuit assembly; and microcircuit set. See also absorber, overvoltage.