Model: 5962-8685908XB

Memory Microcircuit

Properties:

Body Length
Between 11.23 millimeters and 11.68 millimeters
Body Width
Between 11.23 millimeters and 11.68 millimeters
Body Height
Between 1.52 millimeters and 2.54 millimeters
Maximum Power Dissipation Rating
1.0 watts
Operating Tempurature Range
-55.0/+125.0 degrees celsius
Storage Tempurature Range
-65.0/+150.0 degrees celsius
Inclosure Configuration
Leadless flat pack
Output Logic Form
Complementary-metal oxide-semiconductor logic
Current Rating Per Characteristic
115.00 milliamperes supply
Terminal Surface Treatment
Solder
Part Name Assigned By Controlling Agency
Microcircuits, digital, cmos 16k x 4 sram, monolithic silicon
Voltage Rating And Type Per Characteristic
-0.5 volts power source and 7.0 volts power source
Memory Device Type
Ram
Memory Capacity
16k x 4
Terminal Type And Quantity
28 leadless
NSN
5962-01-415-6197
Part Number
5962-8685908XB
Description
Microcircuit,memory
CAGE
67268

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.

Part 5962-8685908XB NSN 5962-01-415-6197

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
41015
FIIG:
A458A0
Concept No.:
1
App. Key:
F
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
D
ESD:
D
MMAC:
BA
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
--
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
39
LVL_A:
Q
LVL_B:
Q

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Schedule B and Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Electronic integrated circuits and microassembly parts

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