Special Features:

3three phase bridges; 3.5 amp; fused-in-glass-diodes; 5 solder terminals; m65 to p150 degrees c operating and storage temp range; ac current input; 0.750 in. Square body; 0.970 in. Max lg o/a; 2 size 0.156 in. Min diameter mtg holes; mounts directly to heat sink

Properties:

Two or more diode semiconductor devices designed to function as a unit in changing alternating current to direct current. The diode devices are internally connected in series, and are permanently cased, encapsulated, potted, or molded together to form an inseparable unit. These units may be designed as either half-wave or full-wave rectifiers and may be mounted to form either single phase or three phase bridges. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items fabricated in the form of a monolithic or thin film structure that perform the function of a circuit, see integrated circuit (as modified). Excludes semiconductor devices, unitized; semiconductor device assembly; and rectifier network, unitized.