Special Features:

Heatsink 1; cap module assembly 1; insulator 13; xstr 2; term 32; conn 2; dio 3; cap 12; res 8; xmfr 2

Properties:

A grouping of two or more different types of electrical/electronic components mounted on a common mounting. it may include an assembly of electrical/electronic components mounted on multiple printed wiring board(s) mounted back to back, stacked, and the like. the item is generally a component of a subassembly and cannot be assigned a more definite item name. excludes items which may be identified as a subassembly. for an assembly of electrical/electronic components mounted on a single printed wiring board, see circuit card asseembly. do not use if a more specific name applies.