Model: 51263

Unitized Semiconductor Devices

Properties:

Inclosure Material
Ceramic or metal
Overall Length
Between 0.240 inches and 0.260 inches
Overall Height
Between 0.030 inches and 0.070 inches
Overall Width
Between 0.140 inches and 0.260 inches
Component Name And Quantity
8 semiconductor device diode
Mounting Method
Terminal
Semiconductor Material
Silicon all semiconductor device diode
Voltage Rating In Volts Per Characteristic
40.0 working peak reverse voltage all semiconductor device diode
Current Rating Per Characteristic
0.25 amperes forward current, total rms megahertz all semiconductor device diode and 0.33 amperes source cutoff current preset all semiconductor device diode and 0.80 amperes forward current, average blank all semiconductor device diode
Power Rating Per Characteristic
0.40 watts small-signal input power, common-collector absolute all semiconductor
Maximum Operating Tempurature Per Measurement Point
150.0 degrees celsius ambient air
Test Data Document
92220--511-026 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)
Terminal Type And Quantity
10 pin
NSN
5961-00-283-1710
Part Number
51263
Description
Semiconductor Devices,unitized
CAGE
07421

Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.

Part 51263 NSN 5961-00-283-1710

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
61962
FIIG:
A110A0
Concept No.:
App. Key:
E
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
B
ESD:
B
MMAC:
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
O
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
063025
UFC:
34525
LTL:
RATING VARIABLE
LCL:
--
WCC:
72D
TCC:
3
SHC:
9
ACC:
Instruments/Radio

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Schedule B and Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Semiconductor devices, nesoi

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