Model: 46-232139P1

Printed Wiring Board

Special Features:

Epoxy glass; 3.700 in. W; 1.700 in. W; 0.062 in. H; 2 holes 0.177 in. Dia, on 3.300 in. By 0.200 in. Centers; 2 holes 0.177 in. Diameter on 1.200 in. By 0.200 in. Centers; 8 mounting holes 0.046 in. Diameter for relay

Properties:

End Application
6525-01-159-3009, field radiographic/fluoroscopic x-ray system; model dxd 350 ii
NSN
5998-01-227-3587
Part Number
46-232139P1
Description
Printed Wiring Board
CAGE
24456

An insulating panel upon which completely processed electrical conductor paths are deposited, etched, or printed in various patterns to provide or complete a circuit between two or more points. It may provide contacts for plug-in connecting facilities. It may be designed for panel or chassis mounting, or for insertion into a connector, receptacle, electrical. For items containing printed electronic components, see printed circuit board. For items containing separately manufactured electronic components, see circuit card assembly. For items consisting only of electrical conductor paths and two or more connectors, see backplane assembly.

Part 46-232139P1 NSN 5998-01-227-3587

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
61737
FIIG:
A500M0
Concept No.:
App. Key:
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
A
ESD:
A
MMAC:
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
MPPWN00001
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Z
LVL_B:

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
061045
UFC:
34580
LTL:
RATING VARIABLE
LCL:
--
WCC:
72D
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Schedule B and Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Electronic integrated circuits and microassembly parts

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