Description:

Bonding machine , gold wire ball bonder with bausch .

Special Features:

Gold wire ball bonder with bausch and lomb microscope, paired eyepiece, spotlight targeting, manual hand z operation, adj-height station heated w0rkholder with 0.1 in. Slots and one half in. Spool adapters; 900 ms cycle time; 10 to 160 grams bond force; 10 to 100 ms bond time; ultrasonic power (max) low 1.3 w and high 2.0 w; 5 in throat depth; 330 military reset to overtravel; search/loop range 0.02 in. Under reset to 0.02 above lowest overtravel; tablemotion; gross 6.5 in., fine 0.5 in. Dia.; 3.75 x 3.75 in. Bonding area; 6: 1 chessman ratio; constant tail length; 100 to 240 volts porm 10 pct; 50/60 hz, 70 va max; 26 in. H x 23.5 in. W x 26 in. D, for d9145-13494 ta-611

Properties:

Inc 66718 reinstated on 051713~places and ultrasonically welds fine wire between connections on a circuit card assembly or a microcircuit and to other electronic components. it consists of an integrated system of a ultrasonic generator, wire feeder, motion controller and workpiece holding device. may be wedge, ball, die or hand type. some machines are automated and may include automated assembly and workpiece transfer features.