Special Features:

Material plastic laminated per military p 18177 and plastic laminated, grade g10, l-p-509; 8.000 in. Lg; 8.000 in. W; 6.525 in. H; four 0.206 in. Diameter min to 0.212 in. Diameter max mtg holes; two 0.235 in. Diameter min to 0.241 in. Diameter max mtg holes; four 0.210 in. Diameter min to 0.216 in. Diameter max mtg holes, 0.500 in. Diameter cbore, 0.180 in. Deep far side; thirteen 0.093 in. Diameter min to 0.099 in. Diameter max mtg holes

Properties:

An item fabricated from electrically nonconductive material specifically designed to provide a support for mounting an electrical and/or an electronic component such as a semiconductor device, relay, or resistor into the next higher assembly. It isolates the component from the mounting surface of the next higher assembly, it may act as a strain relief to avoid damage to the component seal, and it may permit soldering of the component to the next higher assembly without damage. It includes holes, notches, or other provisions for physical alignment and spacing of electrical leads and/or other mounting facilities projecting from the component it mounts. It may also afford protection from shock or vibration. It may be either nonthermally conductive which protects the component from temperature changes in the next higher assembly or it may be thermally conductive which permits heat generated in the component to be drained out to a heat sink. For items whose function is electrical insulation only, see insulator, (as modified). Excludes holder, (as modified); retainer, (as modified), and spacer, plate.