Model: 323-165

Semiconductor Device Cover
Description:

Nylon material, plastic polyamide material.

Properties:

Material
Nylon
Material
Plastic polyamide
NSN
5961-00-004-0073
Part Number
323-165
Description
Cover,semiconductor Device
CAGE
13848

A cover specifically designed to protect a semiconductor device.

Part 323-165 NSN 5961-00-004-0073

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
36796
FIIG:
T23700
Concept No.:
1
App. Key:
AP
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
U
ESD:
ESD:
MMAC:
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
--
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
O
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
061530
UFC:
35360
LTL:
70.0
LCL:
--
WCC:
72D
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Phone: +1 470-231-0824
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Schedule B and Export
  • Schedule B: 8541900000
  • SITC: 77688
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Diode, transistor & similar semiconductor device parts

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