Special Features:

Leads to be nickel plated alloy with copper core; will have 100-300 microinches of electroless nickel and be solder dipped

Properties:

An active semiconductor device with three or more electrodes. May or may not include mounting hardware and/or heatsink. Excludes semiconductor device, diode and semiconductor device, thyristor. For solid state devices which are responsive to visible or infrared radiant energy, see semiconductor device, photo.