Model: 29661DC

Memory Microcircuit

Properties:

Body Length
0.840 inches
Body Width
Between 0.220 inches and 0.310 inches
Body Height
0.185 inches
Operating Tempurature Range
+0.0/+75.0 degrees celsius
Storage Tempurature Range
-55.0/+150.0 degrees celsius
Features Provided
Hermetically sealed and low power and programmable and schottky and 3-state output and bipolar
Inclosure Material
Ceramic
Inclosure Configuration
Dual-in-line
Output Logic Form
Transistor-transistor logic
Input Circuit Pattern
10 input
Terminal Surface Treatment
Solder
Voltage Rating And Type Per Characteristic
7.0 volts power source
Time Rating Per Chacteristic
70.00 nanoseconds propagation delay time, low to high level output and 70.00 nanoseconds propagation delay time, high to low level output
Memory Device Type
Rom
Memory Capacity
Unknown
Terminal Type And Quantity
16 printed circuit
NSN
5962-01-243-8691
Part Number
29661DC
Description
Microcircuit,memory
CAGE
07933

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.

Part 29661DC NSN 5962-01-243-8691

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
41015
FIIG:
A458A0
Concept No.:
1
App. Key:
F
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
B
ESD:
B
MMAC:
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
--
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
39
LVL_A:
Q
LVL_B:
Q

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Schedule B and Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Electronic integrated circuits and microassembly parts

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