Model: 2639876

Semiconductor Device Assembly

Properties:

Major Components
Printed wiring board 1, thirty one (31) diodes
End Application
Lgm30 ats rehost ita
NSN
5961-01-267-2418
Part Number
2639876
Description
Semiconductor Device Assembly
CAGE
06424

A grouping of two or more semiconducting devices such as light emitting diode; semiconductor device, diode; semiconductor device, photo; semiconductor device, thyristor; and/or transistor mounted on a common mounting or mounted on each other. The devices must be separable and each item must be capable of functioning in accordance with its given name. For assemblies consisting of semiconducting devices permanently cased, encapsulated, or potted together to form a single unit, see rectifier, semiconductor device, unitized and semiconductor devices, unitized. Excludes semiconductor device set; microcircuit assembly; and microcircuit set. See also absorber, overvoltage.

Part 2639876 NSN 5961-01-267-2418

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
35565
FIIG:
T01200
Concept No.:
App. Key:
C
Cond. Code:
2
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
ESD:
MMAC:
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
9.3 X 6.3 X 3.0
Paclk Weight:
1.3000lbs
Item Weight:
0.3000lbs
Item Dim:
005500450005
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
F000003XC3
SPI Rev.:
SPC Mkg:
00
LVL_A:
LVL_B:

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Schedule B and Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Semiconductor devices, nesoi

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