Model: 2037AS785-08

Unitized Semiconductor Devices

Special Features:

Drawing iaw mil-s-19500; test iaw mil-std-750

Properties:

Inclosure Material
Metal
Overall Length
1.573 inches
Overall Height
0.450 inches
Overall Width
1.050 inches
End Application
Cass station e/i fscm 30003
Mounting Facility Quantity
2
Joint Electronic Device Engineering Council/jedec/case Outline Designation
To-3
Component Name And Quantity
2 semiconductor device diode
Mounting Method
Unthreaded hole
Semiconductor Material
Silicon all semiconductor device diode
Voltage Rating In Volts Per Characteristic
600.0 reverse voltage, peak all semiconductor device diode and 1.2 forward voltage, dc all semiconductor device diode
Current Rating Per Characteristic
12.50 amperes forward current, average absolute all semiconductor device diode and 200.00 amperes forward current, average preset all semiconductor device diode and 70.00 microamperes forward current, average peak all semiconductor device diode
Test Data Document
30003-2037as785 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)
Terminal Type And Quantity
2 pin and 1 case
NSN
5961-01-440-3238
Part Number
2037AS785-08
Description
Semiconductor Devices,unitized
CAGE
30003

Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.

Part 2037AS785-08 NSN 5961-01-440-3238

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
61962
FIIG:
A110A0
Concept No.:
App. Key:
E
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
B
ESD:
B
MMAC:
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
O
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
063025
UFC:
34525
LTL:
RATING VARIABLE
LCL:
--
WCC:
72D
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Schedule B and Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Semiconductor devices, nesoi

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