Model: 2014063-009

Memory Microcircuit

Properties:

Body Length
1.290 inches
Body Width
Between 0.500 inches and 0.610 inches
Body Height
0.210 inches
Maximum Power Dissipation Rating
635.0 milliwatts
Operating Tempurature Range
-55.0/+100.0 degrees celsius
Storage Tempurature Range
-65.0/+125.0 degrees celsius
Features Provided
Hermetically sealed and ultraviolet erasable and monolithic and programmable
Inclosure Material
Ceramic and glass
Inclosure Configuration
Dual-in-line
Output Logic Form
N-type metal oxide-semiconductor logic
Input Circuit Pattern
14 input
Case Outline Source And Designator
D-3 mil-m-38510
Terminal Surface Treatment
Solder
Voltage Rating And Type Per Characteristic
-0.3 volts power source and 6.0 volts power source
Memory Device Type
Rom
Test Data Document
96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).
Terminal Type And Quantity
24 printed circuit
NSN
5962-01-175-0303
Part Number
2014063-009
Description
Microcircuit,memory
CAGE
1PQF4

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.

Part 2014063-009 NSN 5962-01-175-0303

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
41015
FIIG:
A458A0
Concept No.:
1
App. Key:
F
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
B
ESD:
B
MMAC:
CRITL:
X

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
061700
UFC:
34580
LTL:
RATING VARIABLE
LCL:
--
WCC:
72D
TCC:
3
SHC:
9
ACC:
Instruments/Radio

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Schedule B and Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Electronic integrated circuits and microassembly parts

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