Model: 143649-301

Semiconductor Device Assembly

Properties:

Major Components
One heatsink, one bracket, one connector plug 14 pin rect., two card retainers and eight jantx1n3890 diodes
NSN
5961-01-234-8778
Part Number
143649-301
Description
Semiconductor Device Assembly
CAGE
22915

A grouping of two or more semiconducting devices such as light emitting diode; semiconductor device, diode; semiconductor device, photo; semiconductor device, thyristor; and/or transistor mounted on a common mounting or mounted on each other. The devices must be separable and each item must be capable of functioning in accordance with its given name. For assemblies consisting of semiconducting devices permanently cased, encapsulated, or potted together to form a single unit, see rectifier, semiconductor device, unitized and semiconductor devices, unitized. Excludes semiconductor device set; microcircuit assembly; and microcircuit set. See also absorber, overvoltage.

Part 143649-301 NSN 5961-01-234-8778

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
35565
FIIG:
T01200
Concept No.:
App. Key:
C
Cond. Code:
2
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
ESD:
MMAC:
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
9.3 X 6.3 X 3.0
Paclk Weight:
3.0000lbs
Item Weight:
2.0000lbs
Item Dim:
006200410012
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
F000002XC3
SPI Rev.:
SPC Mkg:
17
LVL_A:
LVL_B:

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Schedule B and Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Semiconductor devices, nesoi

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