Special Features:

Based on a modular packaging approch, the system can be configured by selecting the backplane, psu, device modules and the number of slots; 19inch rackmount, sheet steel, pregalvinized enclosure; ieee 1101.10/.11 compliaqnt; 2-21 slot backplanes; advanced emc shieldingeffectiveness

Properties:

A box, frame, or plate fabricated of electrically conductive material designed to mount, but which does not include, electronic components and their associated circuitry. it may have facilities for attachment to a rack or cabinet or to accommodate specially designed components. it may include a shielding function, integral wiring, and mounting hardware as part of the item. excludes mounting base, electrical equipment.