Model: 125A365-3

Memory Microcircuit

Properties:

Operating Tempurature Range
-55.0/+125.0 degrees celsius
Features Provided
Hermetically sealed and burn in and electrostatic sensitive and programmed
Inclosure Material
Ceramic
Inclosure Configuration
Flat pack
Case Outline Source And Designator
F-9 mil-m-38510
Terminal Surface Treatment
Solder
Voltage Rating And Type Per Characteristic
7.0 volts power source
Time Rating Per Chacteristic
20.00 nanoseconds delay
Memory Device Type
Pal
Nuclear Hardness Critical Feature
Hardened
Test Data Document
96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).
Terminal Type And Quantity
20 flat leads
NSN
5962-01-389-9959
Part Number
125A365-3
Description
Microcircuit,memory
CAGE
03640

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.

Part 125A365-3 NSN 5962-01-389-9959

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
41015
FIIG:
A458A0
Concept No.:
1
App. Key:
F
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
D
ESD:
D
MMAC:
BQ
CRITL:
H

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
--
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
39
LVL_A:
E
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
061045
UFC:
34580
LTL:
RATING VARIABLE
LCL:
--
WCC:
72D
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Schedule B and Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Electronic integrated circuits and microassembly parts

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