Special Features:

Material: plastic sheet, copper clad, type gfn. Grade a, class 1 per mil-p-13949; finish: tin-lead plate per mil-p-81728; three thousand and forty nine 0.025 in. Min diameter to 0.031 in. Max diameter unthd plated through holes; eight hundred and forty six 0.035 in. Min diameter to 0.041 in. Max diameter unthd plated through holes; forty five 0.046 in. Min diameter to 0.052 in. Max diameter unthd plated through holes; two 0.054 in. Min diameter to 0.060 in. Max diameter unthd plated through holes; ninety nine 0.087 in. Min diameter to 0.090 in. Max diameter unthd plated through holes; two 0.151 in. Min diameter to 0.161 in. Max diameter unthd plated through holes; two 0.124 in. Min diameter unthd unplated through holes; two 0.065 in. Min diameter to 0.071 in. Max diameter unthd unplated through holes; ten 0.249 in. Min diameter to 0.255 in. Max diameter unthd unplated through holes; three holes 0.249 in. Min to 0.252 in. Max diameter unthd unplated through holes

Properties:

An insulating panel upon which completely processed electrical conductor paths are deposited, etched, or printed in various patterns to provide or complete a circuit between two or more points. It may provide contacts for plug-in connecting facilities. It may be designed for panel or chassis mounting, or for insertion into a connector, receptacle, electrical. For items containing printed electronic components, see printed circuit board. For items containing separately manufactured electronic components, see circuit card assembly. For items consisting only of electrical conductor paths and two or more connectors, see backplane assembly.