Model: 10M200ZB2

Semiconductor Device Set
Description:

Metal all semiconductor device diode inclosure material, 1.250 inches all semiconductor device diode overall length, zener diode function for which designed.

Properties:

Inclosure Material
Metal all semiconductor device diode and glass all semiconductor device diode
Overall Length
1.250 inches all semiconductor device diode
Function For Which Designed
Zener diode
Mounting Facility Quantity
1 all semiconductor device diode
Electrode Internally-electrically Connected To Case
Base all semiconductor device diode
Component Function Relationship
Matched
Component Name And Quantity
2 semiconductor device diode
Mounting Method
Threaded stud all semiconductor device diode
Features Provided
Hermetically sealed case and mounting hardware
Overall Width Across Flats
0.437 inches all semiconductor device diode
Thread Size
0.190 inches all semiconductor device diode
Semiconductor Material
Silicon all semiconductor device diode
Voltage Rating In Volts Per Characteristic
400.0 regulator voltage all semiconductor device diode
Voltage Tolerance In Percent
-2.0/+2.0 all semiconductor device diode
Voltage Tolerance In Percent
-2.0 to 2.0 all semiconductor device diode
Current Rating Per Characteristic
40.00 milliamperes source cutoff current horsepower metric all semiconductor device diode
Power Rating Per Characteristic
10.0 watts small-signal input power, common-collector preset all semiconductor device diode
Maximum Operating Tempurature Per Measurement Point
175.0 degrees celsius junction all semiconductor device diode
Thread Series Designator
Unf all semiconductor device diode
Terminal Type And Quantity
1 threaded stud all semiconductor device diode and 1 tab, solder lug all semiconductor device diode
NSN
5961-00-087-6963
Part Number
10M200ZB2
Description
Semiconductor Device Set
CAGE
1VPW8

A grouping of two or more individual semiconductor devices, such as transistors, diodes, and photo semiconductor devices. It includes matched pairs. Excludes absorber, overvoltage; semiconductor device assembly. For interconnected items functioning as power supply rectifiers, see rectifier, semiconductor device.

Part 10M200ZB2 NSN 5961-00-087-6963

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
20590
FIIG:
A110A0
Concept No.:
App. Key:
F
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
U
ESD:
B
ESD:
B
MMAC:
EH
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
O
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
063025
UFC:
34525
LTL:
RATING VARIABLE
LCL:
--
WCC:
657
TCC:
3
SHC:
9
ACC:
Instruments/Radio

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Schedule B and Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Semiconductor devices, nesoi

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