Model: 103-619-003

Unitized Semiconductor Devices

Special Features:

All transistor junction pattern arrangement: pnp

Properties:

Inclosure Material
Metal
Overall Length
0.085 inches
Terminal Length
0.500 inches
Overall Diameter
0.270 inches
Joint Electronic Device Engineering Council/jedec/case Outline Designation
To-70
Component Name And Quantity
2 transistor
Mounting Method
Terminal
Terminal Circle Diameter
0.200 inches
Features Provided
Hermetically sealed case
Semiconductor Material
Silicon all transistor
Voltage Rating In Volts Per Characteristic
55.0 breakdown voltage, collector-to-base, emitter open all transistor and 55.0 breakdown voltage, collector-to-emitter, base open all transistor and 7.0 emitter to base voltage, static, collector open all transistor
Current Rating Per Characteristic
10.00 milliamperes source cutoff current all transistor
Power Rating Per Characteristic
400.0 milliwatts small-signal input power, common-collector preset all transistor
Transfer Ratio
175.0 small-signal short-circuit forward current transfer ratio, common-emitter all transistor
Terminal Type And Quantity
8 uninsulated wire lead
Specification Data
80131-release5288 professional/industrial association specification
NSN
5961-00-411-5169
Part Number
103-619-003
Description
Semiconductor Devices,unitized
CAGE
20747

Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.

Part 103-619-003 NSN 5961-00-411-5169

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
61962
FIIG:
A110A0
Concept No.:
App. Key:
E
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
U
ESD:
B
ESD:
B
MMAC:
EH
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.2000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
O
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
063025
UFC:
34525
LTL:
RATING VARIABLE
LCL:
--
WCC:
658
TCC:
3
SHC:
9
ACC:
Instruments/Radio

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Schedule B and Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Semiconductor devices, nesoi

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