Special Features:

Mark serial nr approx where indicated per find nr 11; component markingsneed not be visible after assembly; reference designations per schematic diagram find nr 30 and do not appear on parts; flare find nr 16 this side to be flush or below surface of find nr 1; coat both sides per find nr 19; parts shall meet requirements of mil-std-454; board matl mil-p-13949 type gfn plastic sheet copper clad internal layers 2 ounce copper external layers 1 ounce copper mil-p-13949/12 type pcgf glass cloth b-stage; board construction external conductive layer .0022 min copper thk after plating tin lead plating fused .0003 min thk when measured at crest

Properties:

A grouping of two or more physically connected or related electrical an/or electronic parts capable of dissassemblage. each component of the assemblage must be capable of functioning in accordance with its own item name. consists of a single printed circuit board or terminal board upon which are mounted separately manufactured electronic components such as capacitors, inductors, resistors, and the like. it may also include printed electronic components. the item is generally part of a subassembly and cannot be assigned a more definite item name. for items having a complete individual electrical/electronic function, use applicable item name such as amplifier (as modified); power supply; or the like. for items not having a complete individual electrical/electronic function, see applicable subassembly name, such as amplifier subassembly; power supply subassembly; or the like. for an assembly of electrical/electronic components mounted on other than a single printed wiring board, see electronic components assembly. excludes printed circuit boar