Model: 0M3073SC

Unitized Semiconductor Devices

Special Features:

Single semiconductor device diode junction pattern arrangement: pn

Properties:

Inclosure Material
Metal
Overall Length
0.820 inches
Overall Height
0.275 inches
Overall Width
0.690 inches
Mounting Facility Quantity
1
Component Name And Quantity
1 semiconductor device diode and 1 transistor
Mounting Method
Unthreaded hole
Features Provided
Electrostatic sensitive and hermetically sealed case
Semiconductor Material
Silicon single semiconductor device diode
Semiconductor Material
Silicon single transistor
Voltage Rating In Volts Per Characteristic
1.5 forward voltage, dc single semiconductor device diode
Voltage Rating In Volts Per Characteristic
500.0 drain to source voltage single transistor
Current Rating Per Characteristic
4.50 amperes drain current single transistor
Current Rating Per Characteristic
4.50 amperes forward current, dc single semiconductor device diode
Maximum Operating Tempurature Per Measurement Point
80.0 degrees celsius ambient air
Terminal Type And Quantity
5 uninsulated wire lead
NSN
5961-01-365-5033
Part Number
0M3073SC
Description
Semiconductor Devices,unitized
CAGE

Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.

Part 0M3073SC NSN 5961-01-365-5033

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
61962
FIIG:
A110A0
Concept No.:
App. Key:
E
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
B
ESD:
B
MMAC:
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
--
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
063025
UFC:
34525
LTL:
RATING VARIABLE
LCL:
--
WCC:
72D
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Phone: +1 470-231-0824
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Schedule B and Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Semiconductor devices, nesoi

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